Process development for APSM sets of overlay wafers

Planned purchase (forecast)

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Estimated solicitation date—

Estimated awardFY2026

Estimated value$250K - $499K

Place of performanceMD

Set-asideNone

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Agency: Department of Commerce — National Institute of Standards and Technology
Official source: GSA Acquisition Gateway Forecast · Federal government
Type: Planned purchase (forecast) · Unknown
Posted: Aug 20, 2026
Response deadline: —
Place of performance: MD
Industry (NAICS): Semiconductor and Related Device Manufacturing · 334413
Set-aside: None

Description

IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. As the IRDS identified, SEM overlay measurements are already problematic due to complex 3D structures, material variety, and low signal intensities. This project will create a sound scientific foundation and comprehensive solutions for overlay and any SEM dimension…

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Timeline

PostedAug 20, 2026 · passed
Expected awardFY2026

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