HT In-situ Indenter

Planned purchase (forecast)

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Estimated solicitation date—

Estimated awardFY2026

Estimated value$250K - $499K

Place of performanceMD

Set-asideNone

Description Solicitation documents Register free

Agency: Department of Commerce — National Institute of Standards and Technology
Official source: GSA Acquisition Gateway Forecast · Federal government
Type: Planned purchase (forecast) · Unknown
Posted: Aug 20, 2026
Response deadline: —
Place of performance: MD
Industry (NAICS): Semiconductor and Related Device Manufacturing · 334413
Set-aside: None

Description

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and mechanical incompatibilities among the various interfaces and building blocks of the package. This project will provide indentation and scanning probe-based measurements for the process-induced alterations of the thermo-mechanical properties of…

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Timeline

PostedAug 20, 2026 · passed
Expected awardFY2026

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